Hi Alex,

Please understand with over 40 patents all heading to grant, we had to wait until confirmation of grant before we could provide more technical information for you.

The IBM process you referenced as a potential competitor to Bizen is a complimentary and I2L logic Bipolar process using SoI with a logic cell density no better than CMOS, or worse in the case of I2L due to increased interconnects.
In comparison Bizen Zpolar Tunnel Logic (ZTL) has a 30 times reduced logic cell area compared to CMOS. This is due in part to a reduced equivalent emitter area stemming from a reduced voltage swing and vastly increased transconductance of the Zpolar transistor compared to Bipolar.
Furthermore, Bizen reduces interconnect and active area by having features such as: stacked inputs, single transistor logic, lower peak currents, and shared power supply from the substrate (can't be done on SoI).

As stated previously, the Bizen process is less complex than CMOS or SoI processes, resulting in faster production time, quicker time-to-market and lower production cost.

Finally, the Bizen process combines Logic and Power on the same device. Bizen ZTL can be produced on a 180nm process node with the performance and area equivalent to a 35nm CMOS logic The same die can also contain high voltage silicon power devices with a 100V/ns switch rate and reduced on state power loss compared to Unipolar power devices.

In summary, we do not regard the IBM process as either similar or a competitor.

Bizen Support